Reducing wafer power consumption with atomic layer thin film processing technology

Applied Materials Inc. has announced a breakthrough technology that can reduce the power consumption of semiconductor wafers with the new Applied Producer Onyx thin film processing system. A low-k film is used to isolate several gallons of wire from the wafer. The Producer Onyx system optimizes the molecular structure of the film, enabling customers to commit themselves to faster and faster production at 22 nm and below. More energy efficient logic devices.

Bill McClintock, vice president and general manager of Insulation Systems and Modules Business Unit, Applied Materials, said: “The power consumption of the wire accounts for about one-third of the total power consumption of the wafers, and reducing the power consumption of this part is to increase the advanced logic. The key to the performance of the device and extending the battery life time is through the unique processing capabilities of the Onyx system, an application material company, we can provide the most energy-efficient wire in the industry, while increasing the structural strength and making the wafer more robust to the emerging 3-D. Packaging application requirements. There are currently several Producer Onyx systems for trial production of advanced logic devices."

As the technology evolves, the distance between the wires is getting closer, and the possibility of parasitic capacitance or mutual interference between adjacent wires increases, which leads to wasted power and limits the switching speed. Reducing the value of K for isolating and supporting insulating materials for these structures is a key factor in continuously improving performance and battery life.

Applied Materials' proprietary Onyx technology allows carbon and germanium to enter porous dielectric films and intensify insulating materials at the atomic level. This process can reduce the k value by up to 20%, significantly reducing the power consumption of the wafer. In addition, this procedure can increase the strength of the dielectric film, allowing it to withstand the pressures of subsequent hundreds of processes and packaging operations.