August 25, 2004... Device Offers Radiant Power Up to 180 mW/sr for Higher Performance, Cost Savings in Consumer, Industrial Products
PALO ALTO, California USA -- Agilent Technologies Inc. (NYSE: A) today introduced a new high-speed LED infrared (IR) emitter. The new product, from Agilents Semiconductor Products Group, uses the companys high-power aluminum gallium arsenide ( AlGaAs) LED technology, which has been optimized for high radiant intensity, speed and low forward voltage.
The Agilent HSDL-4261 IR emitter provides manufacturers with a low-cost illumination source suitable for a broad range of applications, from communication devices and IR LANs to consumer products such as optical mice, IR headphones, microphones and keyboards.
The HSDL-4261 emitter features 15 ns rise time and 45 ns fall time (10 percent to 90 percent), with intensities of up to 180 mW/sr (typical) at ILED=100 mA at a 26-degree viewing angle. It operates At the 870 nm optical wavelength and is supplied in an industry-standard 5 mm (T-1 3/4) form-factor package.
The Agilent IR emitter is built with iron lead frames that dissipate power during over a wide range of currents. The forward voltage is a low 1.40 volts at 20 mA, which, in some applications, allows two or more of the emitters to be connected in Series without exceeding the supply-voltage capability.
US Pricing and Availability
The Agilent HSDL-4261 is priced at $0.12 each in moderate volumes and is available now through Agilents direct sales channel and worldwide distribution partners.
Further information about Agilents infrared products is available at
About Agilent Technologies
Agilent Technologies Inc. (NYSE: A) is a global technology leader in communications, electronics, life sciences and chemical analysis. The companys 28,000 employees serve customers in more than 110 countries. Agilent had net revenue of $6.1 billion in fiscal year 2003. Information About Agilent is available on the Web at

Printed Circuit Boards Pcb Manufacturing & Fabrication
Topscom is one of the world's leading suppliers of printed circuit boards,Advanced Technology Products:
Backplanes, HDI boards, High-frequency boards,High TG boards, Halogen-free boards, Flexible and Rigid-Flex boards, Hybrids, and any boards with applications in high-tech products.
Over 15 Years of Experience in PCBs Manufacturing, 350,000ft2 monthly | Our products are UL- and RoHS-marked | 2-70 Layer Capablity
Topscom has 15 years of experience in researching and manufacturing PCBs. We provide an extensive range of high-tech prototypes, including HDI boards (5+N+5, stack via and resin plug, laser drill in-house), multilayer boards (up to 70 layers) and rigid-flex boards.
We also use special materials, mostly from Rogers, Teflon, Nelco, Getek, BT and Arlon.Monthly Turnout Reaching 350,000 Square Feet,With a 12,000-square-meter factory, more than 500 skilled employees and advanced equipment, we are able to produce 350,000 square feet of PCBs monthly. Our facilities house a Hitachi CO2 laser drill machine, X-ray target hole drill machine, AOI machine, Tektronix impedance measurement machines, XY-Dimension micro-test machines and ionic contamination testers. These allow us to complete a 70-layer prototype in as fast as two weeks.Meeting ISO, UL and RoHS Standards,Our QC procedures are in line with ISO/TS 16949, ISO 13485, ISO/TS 14067 and ISO 14001 standards. This ensures that our products carry UL and RoHS marks. Our R&D center consists of experienced engineers who are committed to high-tech PCB innovation.
From the in house qualification of advanced laminate materials, signal integrity analysis, DFx, Topscom is the leading manufacturer of advanced printed circuit boards. For both high speed and high reliability PCB fabrication, Topscoma will work with global based customer to develop advanced PCBs with unique requirements.
• PCB Layout, CAD, Design for Manufacturability and Cost (DFx)
• Quick-turn PCB Prototyping for High Technology PCBs, Backplanes and Flex Circuits
• High-volume,capability over 70 layers
• Advanced Technology: Latest Laminates, HDI, any Layer Via Structures, Multiple Sequential Laminations
Topscom PCB Factory And Equipment Review:
Complete High Speed PCB & Backplane Solutions:
Topscom provides a fully integrated high speed capability, with in house design, simulation, signal integrity, EMC/RFI analysis, prototyping and production of custom backplanes, high speed PCBs, cables and enclosures.
Mission Critical PCB Solutions
Topscom designs and produces high reliability PCBs and flex circuits for defense and aerospace, medical and robust environments. Certifications include: MIL-PRF55110 & 31032, ITAR, AS-9100, TL 9000, Telecordia GR-78-CORE.
High Speed PCBs:
• Multiple sequential laminations
• HDI, any layer structures
• Over 70 layers
• Thermal coining
• Laser milling
• Blind and backdrilled thru holes
High Speed Backplanes:
• Panel sizes to 54 inches
• Over 70 layers
• Blind and backdrilled thru holes
• Dual diameter holes
• Heavy copper layers
• Connector expertise
Topscom Pcb Circuit Boards Plants Basic Info:
• Multoc Circuit Co.,Ltd. Established in year 2001 And 100% Subsidiary Company is Invested By Topscom
• Factory Location: Multoc Building Park,Futian Industrial Zone, Dingnan City, Jiangxi Province,China.
• Initial Capital of $9,000,000
• Accredited ISO9001 ISO13485 ISO 16949 ISO14000
• Factory production area of over 12000m2
• Over 500 employees
• Sales Revenues: 80 Million USD with 2016 year
• Pcb Circuit Boards Manufacturing,serviced for manufacturing a wide range of products including: Automotive, industrial, medical, consumer, telecom, and Aerospace Devices
• Pcb include: Multilayer Rigid Pcb, HDI Pcb, Over 70 Layer, And Flexible Circuits Pcb, Rigid-Flexible Circuits Pcb.
• Products are 100% exported from China, primarily to Europe and North America.
Pcb Circuit Boards Manufacturing
Pcb Circuit Boards,Multilayer Rigid Pcb,High Frequency Pcb,Aluminum Pcb
Topscom Technology Co., Ltd. , http://www.pcbassemblycn.com